Koh Wen Shi : rechercher sur Z-Library

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1

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Overcoming dicing challenges for low-K copper wafers using nickel-palladium-gold bond pads for automotive application

Tu Anh Tran,, Mathew, V., Wen Shi Koh,, Yow, K. Y., Au, Y. K.

Année:

2012

Langue:

english

Fichier:

PDF, 4.70 MB

english, 2012

2

Failure Analysis of a Steel Motorcycle Kickstand

Zainul Huda, Koh Wen Shi, Robert Bulpett

Journal:

Journal of Failure Analysis and Prevention

Année:

2009

Langue:

english

Fichier:

PDF, 449 KB

english, 2009

3

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Laser grooving characterization for dicing defects reduction and its challenges

Shi, Koh Wen, Beng, Lau Teck, Yow, K.Y.

Année:

2009

Langue:

english

Fichier:

PDF, 2.76 MB

english, 2009

4

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - The characteristics and factors of a wafer dicing blade and its optimized interactions required for singulating high metal stack lowk wafers

Shi, Koh Wen, Yow, K. Y.

Année:

2013

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2013

5

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Investigations of the effects of blade type, dicing tape, blade preparation and process parameters on 55nm node low-k wafer

Koh Wen Shi,, Yow, K.Y, Khoo, Rachel

Année:

2010

Langue:

english

Fichier:

PDF, 1.43 MB

english, 2010

6

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Wire bonding and reliability challenges of Gel filled TPMS packaging

Beng, Lau Teck, Stanley, Job Doraisamy, Lo, Calvin, Shi, Koh Wen

Année:

2013

Fichier:

PDF, 604 KB

2013

7

[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Laser grooving process development for low-k / ultra low-k devices

Lau Teck Beng,, Calvin Lo Wai Yew,, Koh Wen Shi,, Siong Chin Teck,, Yow, K.Y.

Année:

2008

Langue:

english

Fichier:

PDF, 255 KB

english, 2008

8

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Wafer dicing process optimization and characterization for C90 low-k wafer technology

Shi, Koh Wen, Yow, K.Y., Rachel, Khoo, Calvin, Lo

Année:

2009

Langue:

english

Fichier:

PDF, 884 KB

english, 2009

9

Singapore Tele-technology Aided Rehabilitation in Stroke (STARS) trial: protocol of a randomized clinical trial on tele-rehabilitation for stroke patients

Koh, Gerald Choon-Huat, Yen, Shih Cheng, Tay, Arthur, Cheong, Angela, Ng, Yee Sien, De Silva, Deidre Anne, Png, Carolina, Caves, Kevin, Koh, Karen, Kumar, Yogaprakash, Phan, Shi Wen, Tai, Bee Choo, Ch

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 984 KB

english, 2015

10

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Laser grooving on narrow scribe widths on thick flip chip wafer: The challenges and its resolution

Yow, Kai Yun, Koh Wen Shi,

Année:

2010

Langue:

english

Fichier:

PDF, 2.95 MB

english, 2010

11

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Developments of blade dressing technique using SiC board for C90 low-k wafer sawing

Koh Wen Shi,, Yow, K. Y., Khoo, Rachel

Année:

2011

Langue:

english

Fichier:

PDF, 2.00 MB

english, 2011

12

[IEEE 2013 IEEE Symposium on Computational Intelligence in Healthcare and e-health (CICARE) - Singapore, Singapore (2013.04.16-2013.04.19)] 2013 IEEE Symposium on Computational Intelligence in Healthcare and e-health (CICARE) - Multiple-pathway modeling of tumor blood flow for dynamic contrast-enhanced imaging

Shi, Wen, Ser, Wee, Koh, Tong San

Année:

2013

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2013

13

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

Shi, Koh Wen, Yow, K. Y., Lo, Calvin

Année:

2014

Langue:

english

Fichier:

PDF, 1.13 MB

english, 2014

14

[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

Shi, Koh Wen, Yow, K. Y., Lo, Calvin, Kar, Yap Boon, Misran, Halina

Année:

2014

Langue:

english

Fichier:

PDF, 4.27 MB

english, 2014

15

Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer

Shi, Koh Wen, Kar, Yap Boon, Talik, Noor Azrina, Yew, Lo Wai

Journal:

Procedia Engineering

Année:

2017

Langue:

english

Fichier:

PDF, 908 KB

english, 2017

16

The roles of Reactive Oxygen Species and Antioxidants in Cryopreservation

Len, Jia Soon, Koh, Wen Shuo Darius, Tan, Shi-Xiong

Journal:

Bioscience Reports

Année:

2019

Langue:

english

Fichier:

PDF, 6.41 MB

english, 2019

17

The roles of Reactive Oxygen Species and Antioxidants in Cryopreservation

Len, Jia Soon, Koh, Wen Shuo Darius, Tan, Shi-Xiong

Journal:

Bioscience Reports

Année:

2019

Fichier:

PDF, 6.41 MB

2019

18

Probing the origin of the enhanced catalytic performance of sp3@sp2 nanocarbon supported Pd catalyst for CO oxidation

Zhang, Liyun, Ding, Yuxiao, Koh, Yoobin Esther, Mun, Bongjin Simon, Wu, Kuang-Hsu, Niu, Yiming, Shi, Wen, Zhang, Bingsen

Journal:

Année:

2020

Langue:

english

Fichier:

PDF, 1.75 MB

english, 2020

19

Probing the origin of the enhanced catalytic performance of sp3@sp2 nanocarbon supported Pd catalyst for CO oxidation

Zhang, Liyun, Ding, Yuxiao, Koh, Yoobin Esther, Mun, Bongjin Simon, Wu, Kuang-Hsu, Niu, Yiming, Shi, Wen, Zhang, Bingsen

Journal:

Année:

2020

Fichier:

PDF, 1.75 MB

2020